Edge flow element for electroplating apparatus

An electroplating apparatus comprising:

• (a) an electroplating chamber configured to contain an electrolyte and an anode while electroplating metal onto a substrate, the substrate being substantially planar;
• (b) a substrate holder configured to hold the substrate such that a plating face of the substrate is separated from the anode during electroplating, wherein when the substrate is positioned in the substrate holder, a corner forms at the interface between the substrate and substrate holder, the corner defined on top by the plating face of the substrate and on the side by the substrate holder;
• (c) an ionically resistive element including a substrate-facing surface that is separated from the plating face of the substrate by a gap of about 10 mm or less, wherein the ionically resistive element is at least coextensive with the plating face of the substrate during electroplating, the ionically resistive element adapted to provide ionic transport through the ionically resistive element during electroplating;
• (d) an inlet to the gap for introducing electrolyte to the gap;
• (e) an outlet to the gap for receiving electrolyte flowing in the gap;
• and
• (f) an edge flow element configured to direct electrolyte into the corner at the interface between the substrate and the substrate holder, the edge flow element being arc-shaped or ring-shaped and positioned proximate a periphery of the substrate and at least partially radially inside of the corner at the interface between the substrate and the substrate holder,
• wherein the inlet and outlet are positioned proximate azimuthally opposing perimeter locations on the plating face of the substrate during electroplating, and
• wherein the inlet and outlet are adapted to generate cross-flowing electrolyte in the gap to create or maintain a shearing force on the plating face of the substrate during electroplating.