Method of manufacturing multilayer body, method of processing substrate, and multilayer body
AssigneeTokyo Ohka Kogyo Co., Ltd.
InventorsYasushi Fujii, Tatsuhiro Mitake, Atsushi Matsushita
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Abstract
A method for forming a release layer which lies between a substrate and a supporting member and has a property that changes when the release layer absorbs light coming through the supporting member, by carrying out plasma CVD with a high-frequency power that is set so as to be higher than a power at which a mode jump occurs.
Claims7
A method for producing a laminate, the laminate including (i) a substrate, (ii) a light-transmitting supporting member which supports the substrate and (iii) a release layer which lies between the substrate and the supporting member and has a property that changes when the release layer absorbs light coming through the supporting member, wherein the release layer absorbs 80% or more of light having a wavelength of 600 nm or less, wherein
- said method comprises forming the release layer by plasma CVD using a reactive gas containing a fluorocarbon gas as a main component;
- and wherein
- forming the release layer comprises carrying out the plasma CVD with a high-frequency power that is higher than a power at which a mode jump from E-mode plasma to H-mode plasma occurs.
Dependencies are inferred from the claim text.