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US 10,093,834 B2Granted
Polishing composition and polishing method
AssigneeFujimi Incorporated
InventorYasuto Ishida
Life of this patent
Estimating the term…
Abstract
There are provided a polishing composition and a method for polishing capable of, when a substrate including polysilicon is polished, limiting the polishing rate of the polysilicon, and selectively polishing a silicon compound other than the polysilicon, such as silicon nitride. The polishing composition used includes abrasives, an organic acid and a conjugate base of the organic acid.
Claims17
A polishing composition comprising:
- colloidal silica, an organic acid and a conjugate base of the same organic acid as the organic acid, wherein
- the conjugate base of the organic acid is at least one type selected from ammonium salt, sodium salt and potassium salt, and
- the organic acid is chemically bonded to a surface of the colloidal silica.
Dependencies are inferred from the claim text.