Adhesive film and sealing product for organic electronic device using same

A method of encapsulating an organic electronic device OED, the method comprising:

• providing an adhesive film which comprises a curable adhesive layer comprising a curable resin,
• controlling a dimensional tolerance (d) and edge angular tolerance (x) of the adhesive film to satisfy Equations 1 and 2 by storing the adhesive film at −10° C. to 10° C.;
• applying the adhesive film, after controlling a dimensional tolerance (d) and edge angular tolerance (x) to satisfy Equations 1 and 2, to a substrate on which the organic electronic device OED is formed to cover an entire surface of the organic electronic device OED;
• and
• curing the applied adhesive film:
• d=|df−di|<800 μm [Equation 1]
• x=|xf−xi|<0.05 degrees [Equation 2]
• wherein di is a length of a longer side or shorter side of the adhesive film at an optional i point before storing at −10° C. to 10° C., df is a length of a longer side or shorter side of the adhesive film at a point of 2 weeks or more after the optional i point after storing at −10° C. to 10° C., xi is an angle of an edge of the adhesive film at an optional i point before storing at −10° C. to 10° C., and xf is an angle of an edge of the adhesive film at a point of 2 weeks or more after the optional i point after storing at −10° C. to 10° C.