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US 10,093,776 B2Granted
Masterbatch containing heat-sensitive functional additive
AssigneePolyOne—Shanghai, China
InventorsMengge Liu, Yonghua Rhett Liu, Wenyu Shang, Yinyin Zhao
Life of this patent
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Abstract
A heat-sensitive functional additive is protected from multiple heat histories by being mixed at ambient temperature with a pre-formed masterbatch, for let down into thermoplastic resin at the time of final-shaping of the plastic article.
Claims5
A masterbatch, comprising:
- (a) heat-sensitive functional additive and
- (b) ethylene vinyl acetate copolymer and
- (c) an inorganic filler, or a second carrier resin, or both,
- wherein the ethylene vinyl acetate copolymer comprises from about 35 weight percent of the masterbatch to about 60 weight percent of the masterbatch;
- wherein the second carrier resin is selected from the group consisting of polypropylene (PP), polyethylene (PE), polyvinyl chloride (PVC), polycarbonate (PC), acrylonitrile-butadiene-styrene (ABS), polyethylene terephthalate (PET), polybutylene terephthalate (PBT), polyoxymethylene (POM), polyamide (PA), polystyrene (PS), polymethylmethacrylate (PMMA), polyphenylene sulfide (PPS), or polylactic acid (PLA), any copolymer of any of them, any combination thereof;
- wherein the heat-sensitive functional additive which has a boiling point of less than about 150° C. and is selected from the group consisting of fragrances, colorants, ultraviolet or visible light absorbers, lubricants, anti-static agents, antimicrobial agents, and combinations thereof;
- wherein the inorganic filler is selected from the group consisting of talc, mica, barium sulfate, titanium dioxide, calcium carbonate, silicon dioxide, and combinations thereof;
- and
- wherein the heat-sensitive functional additive has been absorbed at ambient temperature into a mixture of the ethylene vinyl acetate copolymer and the inorganic filler or the second carrier resin or both.
6 more elements
Dependencies are inferred from the claim text.