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US 10,093,768 B2Granted
Fast cure epoxy resin compositions
AssigneeCytec Industrial Materials (Derby) Limited
InventorIan Aspin
Life of this patent
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Abstract
Disclosed herein is an epoxy resin compositions comprising an epoxy component and a curing agent component, wherein the curing agent component is at least an aminoalkylimidazole curing agent, and wherein the epoxy component and the curing agent component react together at a temperature of about 100° C. to about 130° C. to form a substantially cured reaction product in about 10 minutes or less. Further disclosed are composite products formed from such epoxy resin compositions.
Claims7
An epoxy resin composition comprising:
- an epoxy component;
- and
- a curing component consisting of (a) an aminoalkylimidazole curing agent represented by the following structure:
- wherein R1, R2 and R3 are each independently hydrogen, alkyl or aryl;
- and n is an integer from 2 to 6, and
- (b) a hardener chosen from isophorone diamine (IPDA), 1,3-(bis(aminomethyl) cyclohexane (BAC), bis-(p-aminocyclohexyl)methane (PACM), diethylenetriamine (DETA), triethylenetetraamine (TETA), tetraethylenepentamine (TEPA), 4,7,10-trioxatridecane-1,13-diamine (TTD) and mixtures thereof;
- wherein the epoxy component is present in an amount of 70 wt % to 94 wt % by weight of the composition, the aminoalkylimidazole curing agent is present in an amount of 5 wt % to 10 wt % by weight of the composition, and the hardener is present in an amount of 1 wt % to 25 wt % by weight of the composition;
- and
- wherein, upon curing at a temperature of about 100° C. to about 130° C., the epoxy component and the curing component react together to form a substantially cured reaction product in about 10 minutes or less.
6 more elements
Dependencies are inferred from the claim text.