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US 10,093,102 B2Granted
Liquid ejecting head and liquid ejecting apparatus
AssigneeSeiko Epson Corporation
InventorSho Kimura
Life of this patent
Estimating the term…
Abstract
A liquid ejecting head includes a nozzle that ejects a liquid, a flow path member formed with a flow path that guides the liquid to the nozzle, a supply path member formed with a supply path that supplies the liquid to the flow path member, and a heater that heats the supply path member. A linear expansion coefficient of the supply path member is greater than a linear expansion coefficient of the flow path member. The flow path member and the supply path member are joined together by a thermoset adhesive. The heater is provided to the supply path member.
Claims6
A liquid ejecting head comprising:
- a nozzle that ejects a liquid;
- a flow path member formed with a flow path that guides the liquid to the nozzle;
- a sealing substrate;
- a supply path member formed with a supply path that supplies the liquid to the flow path member, the supply path provided between the flow path member and the sealing substrate;
- and
- the supply path member having an outer peripheral portion;
- a heater being provided on the outer peripheral portion, and between the flow path member and the sealing substrate;
- a linear expansion coefficient of the supply path member being greater than a linear expansion coefficient of the flow path member;
- the flow path member and the supply path member being joined together by a thermoset adhesive;
- the heater heating the supply path member so that a temperature of the supply path member is within a first predetermined temperature range;
- and
- the heater heating the thermoset adhesive via the supply path member so that a temperature of the thermoset adhesive is within a second predetermined temperature range.
9 more elements
Dependencies are inferred from the claim text.