Method for separating at least two substrates along a selected interface
AssigneeSoitec
InventorsDidier Landru, Christophe Figuet
Life of this patent
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Abstract
A process for separating at least two substrates comprising at least two separation interfaces along one of the interfaces includes, before inserting a blade between the substrate, damaging at least one portion of a peripheral region of a chosen one of the interfaces, then inserting the blade and partially parting the substrates, and applying a fluid in a space between the parted substrates while the blade remains inserted therebetween, and decreasing a rupture energy of the chosen interface by stress corrosion involving breaking of siloxane bonds present at the interface.
Claims20
A method for separating at least two substrates forming part of a structure comprising at least two separation interfaces extending parallel to main faces of the structure, along one interface selected from the at least two separation interfaces, the method comprising:
- before separating the at least two substrates, damaging at least one portion of a peripheral region of the one interface such that a rupture energy in the at least one portion of the peripheral region is lower than a rupture energy of other interface regions of the at least two separation interfaces;
- partially parting the at least two substrates along the one interface in the damaged region;
- and
- applying a fluid in a space between the partially parted at least two substrates and decreasing the rupture energy of the one interface by stress corrosion involving breaking of siloxane bonds present at the one interface.
Dependencies are inferred from the claim text.