Laminating process employing grid-like adhesive application

A process for preparing a laminated molded part from a component and a laminating sheet, comprising:

• applying a hot-melt adhesive at a temperature within a range of 40° C. to 220° C. in a grid-like manner to the surface of at least one of the laminating sheet and of the component, wherein channels are formed on the surface from the grid-like application of the adhesive, and wherein the adhesive covers, upon application, from 40% to 99% of the entire surface of the laminating sheet or the component, whichever is provided with the adhesive grid;
• joining the component and the laminating sheet in such a way that the layer of the adhesive applied in a grid-like manner is arranged between the laminating sheet and the component;
• and
• bonding the laminating sheet with the component by extracting air present between the component and the laminating sheet through the channels by applying a reduced pressure between the component and the laminating sheet.