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US 10,093,055 B2Granted
Component of a molding system for cooling a molded article
AssigneeHusky Injection Molding Systems Ltd.
InventorsJoachim Johannes Niewels, Scott Michael Stedman, Jean-Christophe Witz, Sven Kmoch, Ralf Walter Fisch, Ruud Maria Theodorus Luijs, Peter Yankov
Life of this patent
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Abstract
Disclosed herein, amongst other things is a component of a molding system (e.g. mold component, post-mold component, etc.) having a heat dissipater that is configured to impart a profiled heat removal rate on a selected portion of a molded article that generally matches a heat distribution therein.
Claims10
A component of a molding system, comprising:
- a heat dissipater that is configured to impart a profiled heat removal rate on a selected portion of a molded article that generally matches a heat distribution therein;
- the heat dissipater defines a heat pickup surface;
- the heat dissipater includes a heat removal structure for removal of heat therefrom;
- the heat dissipater includes a first body having a first thermal conductivity that includes at least one void embedded therein with which to vary a heat removal rate imparted, in use, on the selected portion of the molded article in accordance with the heat distribution therein;
- the component is a mold component including at least one of a split insert, a core insert, or an interface component of a mold stack;
- the molded article is a preform for blow molding into a container and the selected portion thereof is a neck portion that includes a cylindrical wall having a thread protruding therefrom;
- the heat dissipater is configured to cool the thread at a first rate and the cylindrical wall at a second rate;
- wherein the thread is interrupted by at least one slot and the heat dissipater is configured to cool the at least one slot at a third rate.
5 more elements
Dependencies are inferred from the claim text.