Mold structure, transfer molding apparatus, and transfer molding method

A transfer molding apparatus comprising:

• a mold structure configured to perform molding, comprising:
• a first mold;
• a second mold configured to be brought together and separated from the first mold;
• a heater on at least one of the first and second molds;
• a first transfer member formed on the first mold, wherein the first transfer member is configured to be moved and separated from the first mold during the molding;
• a second transfer member formed on the second mold, wherein the second transfer member is configured to be moved and separated from the second mold during the molding;
• a first transfer surface formed on the first transfer member that is placed in contact with a resin sheet fed between the first and second molds to perform transfer molding onto the resin sheet;
• a second transfer surface formed on the second transfer member that is placed in contact with a resin sheet fed between the first and second molds to perform transfer molding onto the resin sheet;
• a first moving mechanism that moves the first mold away from the first transfer member during the molding;
• and
• a second moving mechanism that moves the second mold away from the second transfer member during the molding,
• wherein the first transfer member comprises a first cooling unit that cools the first transfer member that is maintained in contact with the resin sheet and that has been moved and separated from the first mold,
• wherein the second transfer member comprises a second cooling unit that cools the second transfer member that is maintained in contact with the resin sheet and that has been moved and separated from the second mold,
• wherein the first and second molds are maintained at a substantially same temperature.