Methods and apparatuses for cleaning electroplating substrate holders

A method of cleaning a lipseal and/or cup bottom of an electroplating device by removing metal deposits accumulated on an inner circular edge of the lipseal and/or cup bottom in prior electroplating operations, the method comprising:

• orienting a first nozzle relative to the lipseal and/or cup bottom such that the first nozzle is pointed substantially at the inner circular edge of the lipseal and/or cup bottom, wherein the first nozzle is a jet nozzle having a base and a tip, the jet nozzle having a larger interior diameter at the base than at the tip, wherein the interior diameter of the jet nozzle tapers from the base to the tip, wherein the inner circular edge is the innermost surface of the lipseal and/or cup bottom that is exposed to an electrolyte during electroplating of a wafer;
• rotating the lipseal and cup bottom in a first rotational direction;
• and
• dispensing a stream of the cleaning solution having a fluid velocity between about 5 and 40 meters/second from the first nozzle such that the stream of the cleaning solution contacts the inner circular edge of the lipseal and/or cup bottom while they are rotating in the first rotational direction, removing metal deposits from the lipseal and/or cup bottom, wherein the dispensed stream of the cleaning solution has a velocity component opposing the first rotational direction.