Device and method for applying a material to a substrate

Device (1) for heating a substrate (8) according to a predetermined temperature profile for crystallizing a material on the substrate, provided with

• at least one process chamber (5) which is provided with
• a first and a second sealable opening (6;
• 7) for a substrate (8) to pass through, a first inlet (11) for receiving a process gas in the process chamber and a first transport member (14) for discharging an off-gas from the process chamber;
• an evaporator device (10) for evaporating the material, which evaporator device (10) is connected to the process chamber (5) for supplying the process gas to the process chamber, wherein the process gas is partially saturated with the material in vapour phase;
• a first condensation device (16) for receiving the off-gas, which device is connected to the process chamber (5) via a first transport member (14) for transporting the off-gas to the first condensation device (16), wherein the first condensation device (16) is designed to condense the material in the vapour phase in the off-gas to form a solid phase;
• wherein the device is further provided with:
• a second condensation device (17) for condensing part of the material in vapour phase in the off-gas to form a liquid phase, which second condensation device (17) connects the first condensation device (16) to the process chamber (5) via the first transport member (14);
• and
• a second transport member (18) between the evaporator device (10) and the second condensation device (17) for transporting condensed material from the second condensation device (17) to the evaporator device (10).