Multiple viewing elements endoscope system with modular imaging units

A modular imaging unit assembly adapted to be positioned within an endoscope tip, the imaging unit comprising:

• front, first side, and second side optical elements for receiving reflected light, said front optical element having a central longitudinal axis;
• a holder for housing said front, first side, and second side optical elements;
• front, first side, and second side sensors for detecting said reflected light, wherein said front, first side, and second side sensors are attached to surfaces of said holder, and wherein said front, first side, and second side sensors are in optical communication with said front, first side, and second side optical elements, respectively;
• and
• front, first side, and second side printed circuit boards, wherein said front and at least one of the first and second side printed circuit boards extend parallel to each other;
• a connector connecting said front sensor with said front printed circuit board, wherein said connector includes a first plate member having a first width and a first length, and a second plate member having a second length and a second width, wherein the first width is less than the second width, and the first length is longer than the second length;
• wherein the holder further comprises:
• a first compartment defined by a first wall and a curved base,
• a second compartment defined by said first wall, a second wall, and a third wall, and
• a third compartment defined by the first wall, the second wall, and a fourth wall, and
• wherein the first plate member is positioned atop the third compartment and is perpendicular to the first wall and fourth wall.

A modular imaging unit assembly adapted to be positioned within an endoscope tip and having at least two modular imaging units, the modular imaging unit assembly comprising:

• an assembly holder comprising at least a first compartment and a second compartment;
• a front modular imaging unit positioned within the first compartment, wherein the front modular imaging unit comprises:
• a front optical element for receiving reflected light, said front optical element having a front central longitudinal axis,
• a front sensor for detecting said reflected light, wherein said front sensor is in optical communication with said front optical element,
• a front printed circuit board having a planar surface, and
• a front connector connecting said front sensor with said front printed circuit board, wherein the front connector places said front sensor in data communication with said front printed circuit board;
• and
• a side modular imaging unit positioned within the second compartment, wherein the at least one side modular imaging unit comprises:
• a side optical element for receiving reflected light, said side optical element having a side central longitudinal axis, wherein said side central longitudinal axis is substantially perpendicular to said front central longitudinal axis,
• a side sensor for detecting said reflected light, wherein said side sensor is in optical communication with said side optical element, and
• a side printed circuit board having a planar surface, wherein the planar surface of the side printed circuit board is parallel to the planar surface of the front printed circuit board, and wherein the planar surfaces of the front and side printed circuit boards are perpendicular to the side central longitudinal axis;
• wherein the front and side printed circuit boards are positioned adjacent to, and parallel to, each other, and proximal to each of the first compartment and the second compartment, and
• wherein the front connector extends from the front optical element to a position proximal of the second compartment without extending through the second compartment.