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US 10,087,525 B2Granted
Variable gap hard stop design
AssigneeASM IP Holding B.V.
InventorsMichael Schmotzer, Shawn Whaley
Life of this patent
Estimating the term…
Abstract
A reaction system for processing semiconductor substrates is disclosed. The reaction system includes a susceptor for holding the substrate as well as a baseplate as a part of housing for the reaction system. A pin located on the susceptor can interact with a baseplate feature located on the baseplate to result in a variable gap between the susceptor and the baseplate. The baseplate feature may take the form of a series of steps, a wedge, or a milled-out feature.
Claims20
A reaction system comprising:
- a susceptor configured to hold a substrate for processing;
- a pin embedded within the susceptor;
- a baseplate of a reaction region, the baseplate interacting with the susceptor at a periphery of the susceptor;
- a movement element configured to rotate the susceptor and the substrate;
- and
- a baseplate feature located on the baseplate;
- wherein a gap is formed between the susceptor and the baseplate when the pin contacts the baseplate feature;
- wherein a size of the gap can be adjusted based upon a location of the pin's contact on the baseplate feature;
- and
- wherein the baseplate feature comprises a series of steps.
7 more elements
A reaction system comprising:
- a susceptor configured to hold a substrate for processing;
- a pin embedded within the susceptor;
- a baseplate of a reaction region, the baseplate interacting with the susceptor at a periphery of the susceptor;
- a movement element configured to rotate the susceptor and the substrate;
- and
- a baseplate feature located on the baseplate;
- wherein a gap is formed between the susceptor and the baseplate when the pin contacts the baseplate feature;
- wherein a size of the gap can be adjusted based upon a location of the pin's contact on the baseplate feature;
- and
- wherein the baseplate feature comprises a wedge.
7 more elements
A reaction system comprising:
- a susceptor configured to hold a substrate for processing;
- a pin embedded within the susceptor;
- a baseplate of a reaction region, the baseplate interacting with the susceptor at a periphery of the susceptor;
- a movement element configured to rotate the susceptor and the substrate;
- and
- a baseplate feature located on the baseplate;
- wherein a gap is formed between the susceptor and the baseplate when the pin contacts the baseplate feature;
- wherein a size of the gap can be adjusted based upon a location of the pin's contact on the baseplate feature;
- and
- wherein the baseplate feature is created by milling out of a portion from the baseplate, resulting in the baseplate feature comprising a vertical surface, a horizontal surface, and a sloped surface.
7 more elements
A baseplate assembly comprising:
- a baseplate configured to define an area in which a reaction takes place;
- and
- a baseplate feature disposed on the baseplate;
- wherein the baseplate feature is configured to interact with a pin located on a susceptor holding a substrate;
- wherein a contact of the pin onto the baseplate feature creates a gap between the baseplate and the susceptor, a size of the gap being dependent on a location of the contact relative to the baseplate feature;
- and
- wherein the baseplate feature comprises a step.
4 more elements
A baseplate assembly comprising:
- a baseplate configured to define an area in which a reaction takes place;
- and
- a baseplate feature disposed on the baseplate;
- wherein the baseplate feature is configured to interact with a pin located on a susceptor holding a substrate;
- wherein a contact of the pin onto the baseplate feature creates a gap between the baseplate and the susceptor, a size of the gap being dependent on a location of the contact relative to the baseplate feature;
- and
- wherein the baseplate feature comprises a wedge.
4 more elements
A baseplate assembly comprising:
- a baseplate configured to define an area in which a reaction takes place;
- and
- a baseplate feature disposed on the baseplate;
- wherein the baseplate feature is configured to interact with a pin located on a susceptor holding a substrate;
- wherein a contact of the pin onto the baseplate feature creates a gap between the baseplate and the susceptor, a size of the gap being dependent on a location of the contact relative to the baseplate feature;
- and
- wherein the baseplate feature is created by milling out of a portion from the baseplate, resulting in the baseplate feature comprising a vertical surface, a horizontal surface, and a sloped surface.
4 more elements
Dependencies are inferred from the claim text.