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US 10,087,110 B2Granted
Formation of voids within components formed from porous substrates
AssigneeUnited Technologies Corporation
InventorsPaul Sheedy, Wayde R. Schmidt
Life of this patent
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Abstract
A method of creating a component comprises forming a substrate and depositing a template material within the substrate, such that there are a plurality of template member. The component is heated to a temperature above a melting point of the template material, such that the template material wicks into a porosity of the substrate and forms a component with voids. An average hydraulic diameter of the voids is less than 1 millimeter.
Claims19
A method of creating a component comprising:
- forming a substrate and depositing a template material within said substrate, such that there are a plurality of template members;
- and
- heating said component to a temperature above a melting point of said template material, such that said template material wicks into a porosity of said substrate and forms a component with voids, wherein an average hydraulic diameter of said voids is less than 1 millimeter, and wherein a shell of silicon is formed around said voids to insulate, at least in part, the substrate material.
Dependencies are inferred from the claim text.