Edgeless large area camera system

A detecting apparatus head, comprising:

• a mother board electronically and mechanically connected to at least one dead-zone-less detector module having a substrate;
• at least one multi-tier 3D integrated ASIC (Application-Specific Integrated Circuit) comprising at least one analog tier and at least one digital tier connected to at least one segmented sensor, wherein at least one tier of said at least one multi-tier 3D integrated ASIC is bonded to said at least one segmented sensor and at least one tier of said at least one multi-tier 3D integrated ASIC is bonded to said substrate of said at least one dead-zone-less detector module;
• at least one data processing, computation, and transmission circuit, wherein said at least one data processing, computation, and transmission circuit is mounted onto a side of said at least one dead-zone-less detector module opposite said at least one multi-tier 3D integrated ASIC;
• a thermal management system comprising a cooling system that includes a chiller and a heat exchanger, wherein said heat exchanger is located within said detecting apparatus head and between said motherboard and said at least one dead-zone-less detector module.