Composition for forming conductive pattern and resin structure having conductive pattern

A resin structure having a conductive pattern comprising:

• a polymer resin substrate;
• a non-conductive metal compound including at least one phosphate selected from the group consisting of phosphates represented by Chemical Formulas 1 to 4 below dispersed in the polymer resin substrate;
• a carbide, a carbon-based material, a nitride-based material, a metal oxide or a mixture thereof as a heat-dissipating material dispersed in the polymer resin substrate;
• an adhesion-activated surface including a metal nucleus exposed on a surface of a predetermined region of the polymer resin substrate;
• and
• a conductive metal layer formed on the adhesion-activated surface:
• AxB2P3O12 [Chemical Formula 1]
• Cu3-yM1yP2O8 [Chemical Formula 2]
• Cu2-zM2zP2O7 [Chemical Formula 3]
• Cu4P2O9 [Chemical Formula 4]
• in Chemical Formula 1, x is a rational number from 0.5 to 1, A is at least one metal selected from the group consisting of Li, Na, Cu, Ag and Au, and B is at least one metal selected from the group consisting of Sn, Ti, Zn and Hf,
• in Chemical Formula 2, y is a rational number from 0 to less than 3, M1 is at least one metal selected from the group consisting of Ti, V, Cr, Mn, Fe, Co, Ni, Y, Zn, Nb, Mo, Tc, Pd, Ag, Ta, W, Pt and Au, and
• in Chemical Formula 3, z is a rational number from 0 to less than 2, M2 is at least one metal selected from the group consisting of Zn, Mg, Ca, Sr and Ba.