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US 10,061,195 B2Granted
Photosensitive resin composition for dry etching, and method for producing resist pattern for dry etching
AssigneeTokyo Ohka Kogyo Co., Ltd.
InventorsTeruhiro Uematsu, Kiminori Oshio
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Abstract
A photosensitive resin composition for dry etching including a water-soluble resin, a photopolymerizable monomer, and a photopolymerization initiator, and a method for producing a resist pattern for dry etching. The method includes forming a resin layer with the photosensitive resin composition on a substrate; exposing the resin layer with positional selectivity; and developing the exposed resin layer with water at a temperature less than 50° C., so as to form a resist pattern.
Claims5
A method for processing a substrate, comprising:
- forming a resin layer with a photosensitive resin composition on a substrate;
- positionally and selectively exposing the resin layer;
- developing the exposed resin layer with water at a temperature less than 50° C., so as to form a resist pattern;
- and
- dry etching the substrate with the resist pattern as a mask,
- wherein the photosensitive resin composition contains (A) a water-soluble resin, (B) a photopolymerizable monomer, and (C) a photopolymerization initiator,
- wherein the photopolymerization initiator (C) is an oxime ester compound.
4 more elements
Dependencies are inferred from the claim text.