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US 10,059,803 B2Granted
Resin containing oxetane and epoxy groups and resin composition including the same
AssigneeIndustrial Technology Research Institute
InventorTien-Shou Shieh
Life of this patent
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Abstract
A resin containing oxetane and epoxy groups is provided, being formed by reacting (a) a product of reacting 1 part by mole of a mono-oxetane with a hydroxyl group and 1.1 to 2.5 parts by mole of anhydride, and (b) 2.1 to 4.2 parts by mole of a diepoxy compound. The mono-oxetane with a hydroxyl group has a structure: wherein R1 is H, C1-6 alkyl group, C1-6 fluoroalkyl group, alkenyl group, or phenyl group, and R2 is C1-6 alkylene group or vinyl ether group.
Claims11
A resin composition, comprising:
- 100 parts by weight of a resin;
- and
- 1 to 10 parts by weight of a curing agent, wherein the curing agent comprises a UV cationic initiator, thermal cationic initiator, or thermal anionic initiator,
- wherein the resin is formed by reacting:
- (a) a product of reacting 1 part by mole of a mono-oxetane with a hydroxyl group and 1.1 to 2.5 parts by mole of anhydride, and
- (b) 2.1 to 4.2 parts by mole of a diepoxy compound.
3 more elements
Dependencies are inferred from the claim text.