Active ester resin, epoxy resin composition, cured product thereof, prepreg, circuit board, and build-up film
AssigneeDIC Corporation
InventorsKazuo Arita, Tomohiro Shimono
Life of this patent
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Abstract
An active ester resin having a molecular structure represented by Structural Formula (1) where X represents a benzene ring or a naphthalene ring, each R1 independently represents a methyl group or a hydrogen atom, k is 0 or 1, n is 1 or 2, l is 1 or 2, and m is the average of a repeating unit and from 0.25 to 1.5. The active ester resin, as a curing agent, can be combined with an epoxy resin to form at least an epoxy resin composition, a cured product, a prepreg, a circuit board and a build-up film.
Claims6
An active ester resin represented by Structural Formula (1) comprising a structural moiety represented by Structural Formula (i)
- (place Formula (i) and continue—GM)
- where each R1 independently represents a methyl group or a hydrogen atom;
- Ar1 represents a phenylene group, a naphthylene group, or a phenylene group or naphthylene group which has one to three alkyl groups each having 1 to 4 carbon atoms on its aromatic nucleus;
- wherein the active ester resin has a molecular structure represented by Structural Formula (1)
- (place Formula (1) and continue—GM)
- where X represents a benzene ring or a naphthalene ring, k is 0 or 1, n is 1 or 2, l is 1 or 2, and m is the average of a repeating unit and from 0.25 to 1.5.
Dependencies are inferred from the claim text.