Method of manufacturing voice coil

A method of manufacturing a voice coil on a wafer, comprising:

• forming a first passivation layer on a first metal seed layer provided on a wafer;
• patterning the first passivation layer to form a first coil pattern, the first coil pattern including a first via hole in which a first portion of the first metal seed layer is exposed by the first passivation layer, wherein a second portion of the first metal seed layer is exposed by the first passivation layer and is outside the first via hole;
• forming a first photoresist layer on a portion of the first passivation layer and the second portion of the first metal seed layer, wherein the first via hole is exposed by the first photoresist layer;
• filling an inside of the first via hole with a conductive material to form first coil windings;
• and
• after forming the first coil windings, selectively removing the first photoresist layer relative to the first passivation layer.