Selective in situ cobalt residue removal
AssigneeApplied Materials, Inc.
InventorsXikun Wang, Nitin Ingle
Life of this patent
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AssigneeApplied Materials, Inc.
InventorsXikun Wang, Nitin Ingle
Estimating the term…
Exemplary methods for removing cobalt material may include flowing a chlorine-containing precursor into a processing region of a semiconductor processing chamber. The methods may include forming a plasma of the chlorine-containing precursor to produce plasma effluents. The methods may also include contacting an exposed region of cobalt with the plasma effluents. The methods may include flowing a nitrogen-containing precursor into the processing region of the semiconductor processing chamber. The methods may further include contacting the cobalt chloride with the nitrogen-containing precursor. The methods may also include recessing the cobalt, which leaves a residue behind. The methods may include forming a remote plasma of a hydrogen-containing precursor. The methods may also include removing the cobalt residue using plasma effluents of the hydrogen-containing precursor.
An etching method comprising:
A method of producing a gap-free cobalt fill, the method comprising:
Dependencies are inferred from the claim text.