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US 10,046,391 B2Granted
Die apparatus
AssigneeKobayashi Industry Co., Ltd.
InventorKiyomitsu Itou
Life of this patent
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Abstract
A die apparatus capable of removing powder adhering to cut surfaces so as to securely form a cavity in a desired shape includes divided dies reciprocatingly driven by sliders to comes into contact with one another so as to form a cavity. Punches are inserted into the cavity from above and below the cavity. Each divided die is provided with cut surfaces that come into contact with the other divided dies. A gas passage connected to a gas injection port that injects gas from the cut surface is formed in each divided die.
Claims4
A die apparatus comprising:
- a plurality of divided dies configured to come into contact with one another on cut surfaces thereof so as to form a cavity;
- a plurality of sliders configured to reciprocatingly drive each of the plurality of divided dies;
- and
- an upper punch and a lower punch that are inserted into the cavity from above and below of the cavity,
- wherein
- among a pair or each pair of divided dies that are included in the plurality of divided dies and come into contact with each other on the cut surfaces thereof, at least one divided die is provided with a gas passage configured to inject gas through a gas injection port disposed in each cut surface, and
- the gas injection port is provided to be closed when said pair or each pair of divided dies come into contact with each other on the cut surfaces thereof.
4 more elements
Dependencies are inferred from the claim text.