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US 10,043,734 B2Granted
Method and device for vacuum reacting force soldering
AssigneeGuangzhou Ledteen Optoelectronics Co., Ltd
InventorJiabing Su
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AssigneeGuangzhou Ledteen Optoelectronics Co., Ltd
InventorJiabing Su
Estimating the term…
The present invention discloses a vacuum reacting force soldering method, comprising the following steps: die-bonding a chip onto a substrate through soldering to form a semi-finished product; placing the semi-finished product into a vacuum eutectic cavity (6) of a vacuum eutectic stove; vacuum-pumping the vacuum eutectic cavity; preheating the vacuum eutectic cavity to slowly increase the temperature; heating the vacuum eutectic cavity quickly to melt the solder; applying an acting force to the vacuum eutectic cavity to accelerate a rise of the vacuum eutectic cavity after the vacuum eutectic cavity descends; performing forced refrigeration to the exterior of the vacuum eutectic cavity, while introducing a protective gas to the interior thereof; releasing the vacuum state of the vacuum eutectic cavity after the solder is solidified. This invention also discloses a soldering device using the vacuum reacting force eutectic soldering method described herein.
A vacuum reacting force soldering method, comprising the following steps:
A vacuum reacting force soldering device comprising a cabinet, a vacuum eutectic cavity for accommodating the semi-finished product to be soldered, a temperature raising system, a cooling system and a variable speed drive mechanism, the vacuum eutectic cavity is located inside the cabinet and slides with respect to the cabinet in a vertical direction;
Dependencies are inferred from the claim text.