Method of processing location information and method of processing measurement information including the same

A method of processing measurement information of a semiconductor device by a manufacturing equipment used to manufacture the semiconductor device, the method comprising:

• predicting a first parameter value comprising a predicted parameter value of the manufacturing equipment at a first measurement time;
• determining an error range of the manufacturing equipment based on the predicted parameter value;
• measuring a second parameter value con rising a measured parameter value at the first measurement time;
• and
• determining a third parameter value comprising a determined parameter value based on the predicted parameter value, the measured parameter value, and the error range,
• wherein the measured parameter value is a measurement value measured in the manufacturing equipment used for manufacturing a semiconductor device, and
• wherein the manufacturing equipment includes a robotic arm, and the method further includes accepting the measured parameter value as a determined parameter value when the measured parameter value falls within the error range, or rejecting the measured parameter value if the measured parameter value falls outside the error range, and
• controlling a movement of the robotic arm based on a command parameter value, wherein the predicted parameter value is based on a change in the command parameter value applied at a measurement time N.

A method for processing measurement information of a semiconductor device during manufacture by a manufacturing equipment used to manufacture the semiconductor device, the method comprising:

• predicting a first parameter value comprising a predicted parameter value of the semiconductor device at least at a first measurement time;
• determining an error range, wherein the error range has a top which is greater than the predicted parameter value and a bottom which is less than the predicted parameter value;
• measuring a second parameter value comprising a measured parameter value of the semiconductor device at a second measurement time, wherein the second measurement time occurs after the first measurement time;
• accepting the measured parameter value as a determined parameter value when the measured parameter value falls within the error range, or rejecting the measured parameter value if the measured parameter value falls outside the error range, and
• wherein the manufacturing equipment includes a robotic arm, and the method further includes controlling a movement of the robotic arm based on a command parameter value, wherein the predicted parameter value is based on a change in the command parameter value applied at a measurement time N.