Heat-insulating wall, and heat-insulating housing and method for producing the same
AssigneePanasonic Intellectual Property Management Co., Ltd.
InventorsKazutaka Uekado, Tsuyoki Hirai
Life of this patent
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Abstract
A heat-insulating housing (21) includes: a wall body; and an open-cell resin body (4) of thermosetting resin with which a heat-insulating space formed by the wall body is filled by integral foaming, the open-cell resin body including: a plurality of cells (47); a cell film portion (42); a cell skeleton portion (43); a first through-hole (44) formed so as to extend through the cell film portion; and a second through-hole (45) formed so as to extend through the cell skeleton portion, wherein the plurality of cells communicate with one another through the first through-hole and the second through-hole.
Claims6
A heat-insulating wall comprising:
- a wall body whose hollow portion is a heat-insulating space;
- an open-cell resin body formed of a thermosetting resin, with which the heat-insulating space is filled by integral foaming;
- and
- powder dispersed in the open-cell resin body,
- the open-cell resin body comprising:
- a plurality of cells;
- a first through-hole formed so as to extend through the thermosetting resin located between neighboring cells;
- and
- a second through-hole formed at an interface between the thermosetting resin and the powder,
- wherein the plurality of cells communicate with one another through the first through-hole and the second through-hole,
- the dispersed powder is incompatible with the thermosetting resin, and
- the open-cell resin body comprises one of an open-cell urethane foam and an open-cell phenol foam.
Dependencies are inferred from the claim text.