Flowable gapfill using solvents

A method of forming a dielectric layer on a patterned substrate, the method comprising:

• placing the patterned substrate into a substrate processing region of a substrate processing chamber, wherein the patterned substrate comprises a high aspect ratio trench;
• forming a liquid solution by combining a deposition precursor and a solvent;
• placing the liquid solution into an aerosol generator;
• applying ultrasonic or higher frequencies to a piezoelectric transducer submerged in the liquid solution;
• forming aerosol droplets in the aerosol generator from the liquid solution;
• flowing the aerosol droplets into the substrate processing region;
• forming an adsorbed liquid on the patterned substrate by depositing the aerosol droplets on the patterned substrate, wherein the adsorbed liquid comprises the deposition precursor and the solvent;
• flowing the adsorbed liquid along a surface of the patterned substrate into the high aspect ratio trench;
• filling the high aspect ratio trench with the adsorbed liquid beginning at a bottom of the high aspect ratio trench and finishing at an opening of the high aspect ratio trench;
• evaporating the solvent;
• and
• forming the dielectric layer on the patterned substrate from the deposition precursor, wherein the dielectric layer fills the high aspect ratio trench.