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US 10,016,848 B2Granted
Metal particles having intermetallic compound nano-composite structure crystal
AssigneeNapra Co., Ltd.
InventorShigenobu Sekine
Life of this patent
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Abstract
Aiming at providing a metal particle, an electro-conductive paste, a formed article, and a laminated article that are able to form a highly reliable and high-quality electric interconnect, an electro-conductive bonding portion, or a three-dimensional structure that is less likely to produce the Kirkendall void, this invention discloses a metal particle which include an outer shell and a core part, the outer shell including an intermetallic compound and covering the core part.
Claims2
A metal particle consisting of an outer shell and a core part, the core part containing a metal or an alloy;
- the outer shell comprising an intermetallic compound, and covering the core part;
- wherein 50% or more of a total surface area of the core is covered with the outer shell;
- a particle size of the metal particle being from 1 μm to 20 μm;
- the core part containing Sn or a Sn alloy;
- and
- the outer shell containing an intermetallic compound of Sn and Cu.
3 more elements
Dependencies are inferred from the claim text.