US 10,015,915 B2 · Shield film, shielded printed wiring board, and method for manufacturing shield film

Abstract

To provide a shield film which is capable of suitably shielding electric field waves, magnetic field waves, and electromagnetic waves progressing from one side to the other side of the shield film and has good transmission characteristics, a shielded printed wiring board, and a method for manufacturing the shield film, a metal layer 3 which is 0.5 μm to 12 μm thick and an anisotropic conductive adhesive layer 4 which is anisotropic so as to be electrically conductive only in thickness directions are provided in a deposited manner, so that electric field waves, magnetic field waves, and electromagnetic waves progressing from one side to the other side of the shield film are suitably shielded.

Claims13

Dependent claims

A shield film suitable for use in shielding a signal-transmitting circuit from signal-interfering electromagnetic noise, comprising:

a metal layer, which is 2 μm to 12 μm thick;
an insulating layer, which is 1 μm to 10 μm thick and is disposed along and in contact with a first surface of the metal layer;
and
an anisotropic conductive adhesive layer containing conductive filler with an average particle size of 2 μm to 20 μm, which anisotropic conductive adhesive layer is disposed along and in contact with a second, opposite surface of the metal layer;
wherein the shield film exhibits between 74 dB and 96 dB of attenuation of an electric field wave at 1 GHz, as measured using KEC method.

2 more elements

Dependencies are inferred from the claim text.

Shield film, shielded printed wiring board, and method for manufacturing shield film

Life of this patent

Shield film, shielded printed wiring board, and method for manufacturing shield film

Life of this patent

Abstract

Claims13