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US 10,002,828 B2Granted
Methods for microelectronics fabrication and packaging using a magnetic polymer
AssigneeFerric Inc.
InventorsNoah Sturcken, Ryan Davies
Life of this patent
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Abstract
A magnetic polymer for use in microelectronic fabrication includes a polymer matrix and a plurality of ferromagnetic particles disposed in the polymer matrix. The magnetic polymer can be part of an insulation layer in an inductor formed in one or more backend wiring layers of an integrated device. The magnetic polymer can also be in the form of a magnetic epoxy layer for mounting contacts of the integrated device to a package substrate.
Claims12
A method of fabricating a structure, the method comprising:
- disposing a plurality of ferromagnetic particles in an epoxy matrix to form a magnetic epoxy;
- mounting a package substrate on a plurality of contacts of a semiconductor integrated circuit or an integrated passive device, wherein the contacts define a gap between the substrate and the semiconductor integrated circuit or the integrated passive device, the semiconductor integrated circuit or the integrated passive device comprising a multilevel wiring network and an inductor, the inductor integrated into at least one level of the multilevel wiring network;
- flowing the magnetic epoxy into the gap, the magnetic epoxy surrounding the contacts;
- and
- curing the magnetic epoxy to adhere the substrate to the semiconductor integrated circuit or the integrated passive device.
2 more elements
Dependencies are inferred from the claim text.